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New CSP/MicroBGA test and burn-in socket from Aries accomodates devices up to 55 mm2 with pitches of 0.50 mm and larger

July 29, 2004 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a BGA/CSP test and burn-in socket that accommodates device packages up to 55 mm2 in applications up to 1 GHz. The new socket, which features a standard molded socket format, is ideal for the test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with a pitch of 0.50 mm or larger.

A spring-loaded, cam-actuated pressure pad applies force against the device after the socket lid has been closed and latched and the cam is in position. Reversing the cam removes the force prior to unlatching the spring-loaded lid.

The socket features easy mounting and removal from the burn-in board (BIB) via solderless pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless steel screws.

The signal path of the new socket during test is only 1.92 mm (.077”). At pitches above 0.80 mm using a large probe, 1 dB of bandwidth at 1 GHz can be achieved. Operating temperature of the socket ranges from -55°C to 150°C (-67°F to 302°F), and estimated contact life is 500,000 cycles. The socket’s molded components are UL94V-0 PEEK and/or Ultem.

Compression spring probes are heat-treated beryllium copper alloy, plated with 30 µ” min. (.75 µm) gold per Mil-G-45204 over 30 µ” min. (.75 µm) nickel per QQ-N-290. This gold over nickel plating on the probes leaves very small witness marks on the bottom surface of the solder balls. Spring probe contacts are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. All hardware is stainless steel.

As with all Aries sockets, the new burn-in and test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.