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Bumper Beans from parvus Corp. Provide Effective Shock/Vibration Isolation Method for Motherboards in Embedded Computer Systems

Bumper Beans from parvus Corporation Replace Standoffs To Secure Printed Circuit Boards and Absorb Harmful Shock/Vibration Energies

SALT LAKE CITY - February 19, 2003 - parvus Corporation today announced the Bumper Beans line of printed circuit board (PCB) shock and vibration isolators, designed to cushion motherboards, baseboards and other PCBs that experience mechanical stress in high vibration/shock environments. Unit pricing is $10/each.

Bumper Beans serve as replacements for nylon or aluminum standoffs, which are traditionally used to secure a PCB to its enclosure. Embedded computer systems with EBX, ETX, PC/104 or any other form factor of PCB that is mounted directly onto a septum, enclosure, baseplate, or panel could incorporate Bumper Beans to increase reliability and extend component life.

Made of shock-absorbing Silastic(r) silicone rubber with threaded aluminum nuts/screws integrated into each end, Bumper Beans are designed for G-force sine waves between 80-250hz, reducing force by up to a factor of 10. They have a durometer hardness of 59 and measure 0.75" in length and 0.55" in diameter. Bumper Beans also have either 4-40 and/or 6-32 threaded ends in male/female or female/female versions to accommodate different mounting holes and applications.

In addition to being placed underneath circuit boards, Bumper Beans can potentially also be attached to railed card cages, enclosures or any other packaging components with mounting holes to reduce harmful shock/vibration energies experienced during portable, vehicular and other demanding applications.